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| ? 2007 microchip technology inc. ds21667e-page 1 mcp2551 features ? supports 1 mb/s operation ? implements iso-11898 standard physical layer requirements ? suitable for 12v and 24v systems ? externally-controlled slope for reduced rfi emissions ? detection of ground fault (permanent dominant) on txd input ? power-on reset and voltage brown-out protection ? an unpowered node or brown-out event will not disturb the can bus ? low current standby operation ? protection against damage due to short-circuit conditions (positive or negative battery voltage) ? protection against high-voltage transients ? automatic thermal shutdown protection ? up to 112 nodes can be connected ? high noise immunity due to differential bus implementation ? temperature ranges: - industrial (i): -40c to +85c - extended (e): -40c to +125c package types block diagram r s canh canl v ref txd v ss v dd rxd 1 2 3 4 8 7 6 5 pdip/soic mcp2551 thermal shutdown v dd v ss canh canl txd r s rxd v ref v dd slope control power-on reset reference voltage receiver gnd 0.5 v dd txd dominant detect driver control high-speed can transceiver
mcp2551 ds21667e-page 2 ? 2007 microchip technology inc. notes: ? 2007 microchip technology inc. ds21667e-page 3 mcp2551 1.0 device overview the mcp2551 is a high-speed can, fault-tolerant device that serves as the interface between a can protocol controller and the physical bus. the mcp2551 provides differential transmit and receive capability for the can protocol controller and is fully compatible with the iso-11898 standard, including 24v requirements. it will operate at speeds of up to 1 mb/s. typically, each node in a can system must have a device to convert the digital signals generated by a can controller to signals suitable for transmission over the bus cabling (differential output). it also provides a buffer between the can controller and the high-voltage spikes that can be generated on the can bus by outside sources (emi, esd, electrical transients, etc.). 1.1 transmitter function the can bus has two states: dominant and recessive. a dominant state occurs when the differential voltage between canh and canl is greater than a defined voltage (e.g.,1.2v). a recessive state occurs when the differential voltage is less than a defined voltage (typically 0v). the dominant and recessive states correspond to the low and high state of the txd input pin, respectively. however, a dominant state initiated by another can node will override a recessive state on the can bus. 1.1.1 maximum number of nodes the mcp2551 can outputs will drive a minimum load of 45 , allowing a maximum of 112 nodes to be connected (given a minimum differential input resistance of 20 k and a nominal termination resistor value of 120 ). 1.2 receiver function the rxd output pin reflects the differential bus voltage between canh and canl. the low and high states of the rxd output pin correspond to the dominant and recessive states of the can bus, respectively. 1.3 internal protection canh and canl are protected against battery short- circuits and electrical transients that can occur on the can bus. this feature prevents destruction of the transmitter output stage during such a fault condition. the device is further protected from excessive current loading by thermal shutdown circuitry that disables the output drivers when the junction temperature exceeds a nominal limit of 165c. all other parts of the chip remain operational and the chip temperature is lowered due to the decreased power dissipation in the transmitter outputs. this protection is essential to protect against bus line short-circuit-induced damage. 1.4 operating modes the r s pin allows three modes of operation to be selected: ? high-speed ? slope-control ? standby these modes are summarized in table 1-1. when in high-speed or slope-control mode, the drivers for the canh and canl signals are internally regu- lated to provide controlled symmetry in order to mini- mize emi emissions. additionally, the slope of the signal transitions on canh and canl can be controlled with a resistor connected from pin 8 (r s ) to ground, with the slope proportional to the current output at r s , further reducing emi emissions. 1.4.1 high-speed high-speed mode is selected by connecting the r s pin to v ss . in this mode, the transmitter output drivers have fast output rise and fall times to support high-speed can bus rates. 1.4.2 slope-control slope-control mode further reduces emi by limiting the rise and fall times of canh and canl. the slope, or slew rate (sr), is controlled by connecting an external resistor (r ext ) between r s and v ol (usually ground). the slope is proportional to the current output at the r s pin. since the current is primarily determined by the slope-control resistance value r ext , a certain slew rate is achieved by applying a respective resistance. figure 1-1 illustrates typical slew rate values as a function of the slope-control resistance value. 1.4.3 standby mode the device may be placed in standby or ?sleep? mode by applying a high-level to r s . in sleep mode, the transmitter is switched off and the receiver operates at a lower current. the receive pin on the controller side (rxd) is still functional but will operate at a slower rate. the attached microcontroller can monitor rxd for can bus activity and place the transceiver into normal operation via the r s pin (at higher bus rates, the first can message may be lost). mcp2551 ds21667e-page 4 ? 2007 microchip technology inc. table 1-1: modes of operation table 1-2: transceiver truth table figure 1-1: slew rate vs. slope-control resistance value mode current at r s pin resulting voltage at r s pin standby -i rs < 10 a v rs > 0.75 v dd slope-control 10 a < -i rs < 200 a 0.4 v dd < v rs < 0.6 v dd high-speed -i rs < 610 a 0 < v rs < 0.3v dd v dd v rs txd canh canl bus state (1) r xd (1) 4.5v v dd 5.5v v rs < 0.75 v dd 0 high low dominant 0 1 or floating not driven not driven recessive 1 v rs > 0.75 v dd x not driven not driven recessive 1 v por < v dd < 4.5v (see note 3 ) v rs < 0.75 v dd 0 high low dominant 0 1 or floating not driven not driven recessive 1 v rs > 0.75 v dd x not driven not driven recessive 1 0 < v dd < v por x x not driven/ no load not driven/ no load high impedance x note 1: if another bus node is transmitting a dominant bit on the can bus, then rxd is a logic ? 0 ?. 2: x = ?don?t care?. 3: device drivers will function, although outputs are not ensured to meet the iso-11898 specification. 0 5 10 15 20 25 10 20 30 40 49 60 70 76 90 100 110 120 resistance (k ) slew rate v/us ? 2007 microchip technology inc. ds21667e-page 5 mcp2551 1.5 txd permanent dominant detection if the mcp2551 detects an extended low state on the txd input, it will disable the canh and canl output drivers in order to prevent the corruption of data on the can bus. the drivers are disabled if txd is low for more than 1.25 ms (minimum). this implies a maximum bit time of 62.5 s (16 kb/s bus rate), allowing up to 20 consecutive transmitted dominant bits during a multiple bit error and error frame scenario. the drivers remain disabled as long as txd remains low. a rising edge on txd will reset the timer logic and enable the canh and canl output drivers. 1.6 power-on reset when the device is powered on, canh and canl remain in a high-impedance state until v dd reaches the voltage-level v porh . in addition, canh and canl will remain in a high-impedance state if txd is low when v dd reaches v porh . canh and canl will become active only after txd is asserted high. once powered on, canh and canl will enter a high-impedance state if the voltage level at v dd falls below v porl , providing voltage brown-out protection during normal operation. 1.7 pin descriptions the 8-pin pinout is listed in table 1-3. table 1-3: mcp2551 pinout 1.7.1 transmitter data input (txd) txd is a ttl-compatible input pin. the data on this pin is driven out on the canh and canl differential output pins. it is usually connected to the transmitter data output of the can controller device. when txd is low, canh and canl are in the dominant state. when txd is high, canh and canl are in the recessive state, provided that another can node is not driving the can bus with a dominant state. txd has an internal pull-up resistor (nominal 25 k to v dd ). 1.7.2 ground supply (v ss ) ground supply pin. 1.7.3 supply voltage (v dd ) positive supply voltage pin. 1.7.4 receiver data output (rxd) rxd is a cmos-compatible output that drives high or low depending on the differential signals on the canh and canl pins and is usually connected to the receiver data input of the can controller device. rxd is high when the can bus is recessive and low in the dominant state. 1.7.5 reference voltage (v ref ) reference voltage output (defined as v dd /2). 1.7.6 can low (canl) the canl output drives the low side of the can differential bus. this pin is also tied internally to the receive input comparator. 1.7.7 can high (canh) the canh output drives the high-side of the can differential bus. this pin is also tied internally to the receive input comparator. 1.7.8 slope resistor input (r s ) the r s pin is used to select high-speed, slope-control or standby modes via an external biasing resistor. pin number pin name pin function 1 txd transmit data input 2v ss ground 3v dd supply voltage 4 rxd receive data output 5v ref reference output voltage 6 canl can low-level voltage i/o 7 canh can high-level voltage i/o 8r s slope-control input mcp2551 ds21667e-page 6 ? 2007 microchip technology inc. notes: ? 2007 microchip technology inc. ds21667e-page 7 mcp2551 2.0 electrical characteristics 2.1 terms and definitions a number of terms are defined in iso-11898 that are used to describe the electrical characteristics of a can transceiver device. these terms and definitions are summarized in this section. 2.1.1 bus voltage v canl and v canh denote the voltages of the bus line wires canl and canh relative to ground of each individual can node. 2.1.2 common mode bus voltage range boundary voltage levels of v canl and v canh with respect to ground, for which proper operation will occur, if up to the maximum number of can nodes are connected to the bus. 2.1.3 differential internal capacitance, c diff (of a can node) capacitance seen between canl and canh during the recessive state when the can node is disconnected from the bus (see figure 2-1). 2.1.4 differential internal resistance, r diff (of a can node) resistance seen between canl and canh during the recessive state when the can node is disconnected from the bus (see figure 2-1). 2.1.5 differential voltage, v diff (of can bus) differential voltage of the two-wire can bus, value v diff = v canh - v canl . 2.1.6 internal capacitance, c in (of a can node) capacitance seen between canl (or canh) and ground during the recessive state when the can node is disconnected from the bus (see figure 2-1). 2.1.7 internal resistance, r in (of a can node) resistance seen between canl (or canh) and ground during the recessive state when the can node is disconnected from the bus (see figure 2-1). figure 2-1: physical layer definitions r in r in r diff c in c in c diff canl canh ground ecu mcp2551 ds21667e-page 8 ? 2007 microchip technology inc. absolute maximum ratings? v dd ............................................................................................................................... ..............................................7.0v dc voltage at txd, rxd, v ref and v s ............................................................................................ -0.3v to v dd + 0.3v dc voltage at canh, canl ( note 1 ) .......................................................................................................... -42v to +42v transient voltage on pins 6 and 7 ( note 2 ) ............................................................................................. -250v to +250v storage temperature ............................................................................................................ ...................-55c to +150c operating ambient temperature .................................................................................................. ............-40c to +125c virtual junction temperature, t vj ( note 3 ).............................................................................................-40c to +150c soldering temperature of leads (10 seconds) .................................................................................... ...................+300c esd protection on canh and canl pins ( note 4 ) ...................................................................................................6 kv esd protection on all other pins ( note 4 ) ..................................................................................................................4 kv note 1: short-circuit applied when txd is high and low. 2: in accordance with iso-7637. 3: in accordance with iec 60747-1. 4: classification a: human body model. ? notice: stresses above those listed under ?maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. ? 2007 microchip technology inc. ds21667e-page 9 mcp2551 2.2 dc characteristics dc specifications electrical characteristics: industrial (i): t amb = -40c to +85c v dd = 4.5v to 5.5v extended (e):t amb = -40c to +125c v dd = 4.5v to 5.5v param no. sym characteristic min max units conditions supply d1 i dd supply current ? 75 ma dominant; v txd = 0.8v; v dd d2 ? 10 ma recessive; v txd = +2v; r s = 47 k d3 ? 365 a -40c t amb +85c, standby; (note 2) ? 465 a -40c t amb +125c, standby; (note 2) d4 v porh high-level of the power-on reset comparator 3.8 4.3 v canh, canl outputs are active when v dd > v porh d5 v porl low-level of the power-on reset comparator 3.4 4.0 v canh, canl outputs are not active when v dd < v porl d6 v pord hysteresis of power-on reset comparator 0.3 0.8 v note 1 bus line (canh; canl) transmitter d7 v canh (r); v canl (r) canh, canl recessive bus voltage 2.0 3.0 v v txd = v dd ; no load. d8 i o ( canh )(reces) i o ( canl )(reces) recessive output current -2 +2 ma -2v < v( cahl , canh ) < +7v, 0v ? 2007 microchip technology inc. ds21667e-page 11 mcp2551 figure 2-2: test circuit for automotive transients figure 2-3: hysteresis of the receiver r s rext gnd rxd v ref txd 60 500 pf 500 pf note: r s may be connected to v dd or gnd via a load resistor depending on desired operating mode as described in section 1.7.8, ?slope resistor input (rs)? canh canl can transceiver schaffner generator the wave forms of the applied transients shall be in accordance with ?iso-7637, part 1?, test pulses 1, 2, 3a and 3b. v oh v ol 0.5 0.9 hysteresis d19 vdiff (v) rxd (receive data output voltage) v diff (r)(i) v diff (d)(i) mcp2551 ds21667e-page 12 ? 2007 microchip technology inc. 2.3 ac characteristics ac specifications electrical characteristics: industrial (i): t amb = -40c to +85c v dd = 4.5v to 5.5v extended (e): t amb = -40c to +125c v dd = 4.5v to 5.5v param no. sym characteristic min max units conditions 1t bit bit time 1 62.5 s v rs = 0v 2f bit bit frequency 16 1000 khz v rs = 0v 3 ttxl2bus(d) delay txd to bus active ? 70 ns -40c t amb +125c, v rs = 0v 4 ttxh2bus(r) delay txd to bus inactive ? 125 ns -40c t amb +85c, v rs = 0v ? 170 ns -40c t amb +125c, v rs = 0v 5 ttxl2rx(d) delay txd to receive active ? 130 ns -40c t amb +125c, v rs = 0v ? 250 ns -40c t amb +125c, r s = 47 k 6 ttxh2rx(r) delay txd to receiver inactive ? 175 ns -40c t amb +85c, v rs = 0v ? 225 ns -40c t amb +85c, r s = 47 k ? 235 ns -40c t amb +125c, v rs = 0v ? 400 ns -40c t amb +125c, r s = 47 k 7 sr canh, canl slew rate 5.5 8.5 v/s refer to figure 1-1; r s = 47 k , ( note 1) 10 t wake wake-up time from standby (rs pin) ? 5 s see figure 2-5 11 tbusd2rx(s) bus dominant to rxd low (standby mode) ? 550 ns v rs = +4v; (see figure 2-2 ) 12 c in ( canh ) c in ( canl ) canh; canl input capacitance ?20 (typical) pf 1 mbit/s data rate; v txd = v dd , (note 1) 13 c diff differential input capacitance ?10 (typical) pf 1 mbit/s data rate (note 1) 14 ttxl2busz tx permanent dominant timer disable time 1.25 4 ms 15 ttxr2pdt(res) tx permanent dominant timer reset time ? 1 s rising edge on txd while device is in permanent dominant state note 1: this parameter is periodically sampled and not 100% tested. ? 2007 microchip technology inc. ds21667e-page 13 mcp2551 2.4 timing diagrams and specifications figure 2-4: timing diag ram for ac characteristics figure 2-5: timing diagram for wake-up from standby figure 2-2: timing diagram for bus dominant to rxd low (standby mode) 3 5 4 6 0.9v 0.5v 0v v dd txd (transmit data input voltage) v diff (canh, canl differential voltage) rxd (receive data output voltage) 0.3 v dd 0.7 v dd v txd = 0.8v 10 0v v dd v rs slope resistor input voltage v rxd receive data output voltage 0.6 v dd 0.3 v dd v rs = 4v; v txd = 2v 1.5v 0v 11 v diff , differential voltage receive data output voltage 0.9v 0.3 v dd mcp2551 ds21667e-page 14 ? 2007 microchip technology inc. notes: ? 2007 microchip technology inc. ds21667e-page 15 mcp2551 3.0 packaging information 3.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn mcp2551 i/p256 0726 mcp2551 i/sn0726 256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e mcp2551 ds21667e-page 16 ? 2007 microchip technology inc. 8-lead plastic dual in-line (p) ? 300 mil body [pdip] n otes: 1 . pin 1 visual index feature may vary, but must be located with the hatched area. 2 . significant characteristic. 3 . dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" per side. 4 . dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units inches dimension limits min nom max number of pins n 8 pitch e .100 bsc top to seating plane a ? ? .210 molded package thickness a2 .115 .130 .195 base to seating plane a1 .015 ? ? shoulder to shoulder width e .290 .310 .325 molded package width e1 .240 .250 .280 overall length d .348 .365 .400 tip to seating plane l .115 .130 .150 lead thickness c .008 .010 .015 upper lead width b1 .040 .060 .070 lower lead width b .014 .018 .022 overall row spacing eb ? ? .430 n e1 note 1 d 12 3 a a1 a2 l b1 b e e e b c microchip technology drawing c04-018 b ? 2007 microchip technology inc. ds21667e-page 17 mcp2551 8-lead plastic small outline (sn) ? narrow, 3.90 mm body [soic] n otes: 1 . pin 1 visual index feature may vary, but must be located within the hatched area. 2 . significant characteristic. 3 . dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15 mm per side. 4 . dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millmeters dimension limits min nom max number of pins n 8 pitch e 1.27 bsc overall height a ? ? 1.75 molded package thickness a2 1.25 ? ? standoff a1 0.10 ? 0.25 overall width e 6.00 bsc molded package width e1 3.90 bsc overall length d 4.90 bsc chamfer (optional) h 0.25 ? 0.50 foot length l 0.40 ? 1.27 footprint l1 1.04 ref foot angle 0 ? 8 lead thickness c 0.17 ? 0.25 lead width b 0.31 ? 0.51 mold draft angle top 5 ? 15 mold draft angle bottom 5 ? 15 d n e e e1 note 1 12 3 b a a1 a2 l l1 c h h microchip technology drawing c04-057 b mcp2551 ds21667e-page 18 ? 2007 microchip technology inc. notes: ? 2007 microchip technology inc. ds21667e-page 19 mcp2551 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: mcp2551= high-speed can transceiver temperature range: i = -40c to +85c e = -40c to +125c package: p = plastic dip (300 mil body) 8-lead sn = plastic soic (150 mil body) 8-lead part no. x /xx package temperature range device examples: a) mcp2551-i/p: industrial temperature, pdip package. b) mcp2551-e/p: extended temperature, pdip package. c) mcp2551-i/sn: industrial temperature, soic package. d) mcp2551t-i/sn: tape and reel, industrial temperature, soic package. e) mcp2551t-e/sn: tape and reel, extended temperature, soic package. mcp2551 ds21667e-page 20 ? 2007 microchip technology inc. notes: ? 2007 microchip technology inc. ds21667e-page 21 mcp2551 appendix a: revision history revision e (january 2007) this revision includes updates to the packaging diagrams. ds21667e-page 22 ? 2007 microchip technology inc. notes: ? 2007 microchip technology inc. ds21667e-page 23 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of micr ochip technology incorporated in the u.s.a. and other countries. amplab, filterlab, migratable memory, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, appl ication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, linear active thermistor, mindi, miwi, mpasm, mplib, mplink, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powe rtool, real ice, rflab, rfpicdem, select mode, smart serial, smarttel, total endurance, uni/o, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2007, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona, gresham, oregon and mountain view, california. the company?s quality system processes and procedures are for its pic ? mcus and dspic dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. ds21667e-page 24 ? 2007 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway habour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - fuzhou tel: 86-591-8750-3506 fax: 86-591-8750-3521 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - shunde tel: 86-757-2839-5507 fax: 86-757-2839-5571 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7250 fax: 86-29-8833-7256 asia/pacific india - bangalore tel: 91-80-4182-8400 fax: 91-80-4182-8422 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - gumi tel: 82-54-473-4301 fax: 82-54-473-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - penang tel: 60-4-646-8870 fax: 60-4-646-5086 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-572-9526 fax: 886-3-572-6459 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 12/08/06 |
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